Mouse-Team

We have extensive experience in High Speed DDR3 Production. We can completely finish in the First Version.

PCB Layout

Manufacturing Capability In-Process Control Chart Outgoing Quality Assurance Case Timetable

PCB

We keep holding a consistent persistence of specialty and design on work of PCB manufacturing, not because of CAST consideration, but of board production, basic system regulation requirements and quality. With the option to cooperate with the board manufacturer to come up with the best solution for cost and quality.

Manufacturing Capability

Technology Description	Now	Under Development
Minimum Trace/Space (inner/outer)	5/5 mils	4/4 mils
Minimum Finished Hole Diameter	10 mils	6 mils
Maximum Aspect Ratio	8:1	10:1
Minimum Board Thickness - 4 Layer	16 mils	12 mils
Minimum Board Thickness - 6 Layer	24 mils	22 mils
Maximum Board Thickness	125 mils	125 mils
Minimum/Maximum Layer	2/16	up to 20
Minimum SMT Device Pitch	12 mils	10 mils
Minimum SMT Device Land Width	8 mils	6 mils
Board Flatness Tolerance	±0.7%	±0.5%
Layer to Layer Reg. Tolerance	±5 mils	±4 mils
Impedance Control	Partial	Full
Entek / Gold Plating	Yes	Yes
Board Size	20" * 20"	24" * 24"

In-Process Control Chart

Outgoing Quality Assurance

Case Timetable

Classification/Layer	2 Layer	4 Layer	6 Layer	8 Layer	10 Layer	12 Layer
Regular Case	5-day	6-day	6-day	7-day	7-day	8-day
Urgent Case	2-day	3-day	4-day	4-day	5-day	6-day