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佳泰企業有限公司
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製造能力
製造管理流程圖
出貨品質保證管理流程圖
製作交期明細
對於PCB的製作，秉持專業及設計考量，不因COST的考量而併板生產，依據製程的需求與品質，而選擇不同之合作廠商，目前合作的有
| Technology
Description |
Now |
Under
Development |
| Minimum
Trace/Space (inner/outer) |
5/5 mils |
4/4 mils |
| Minimum
Finished Hole Diameter |
10 mils |
6 mils |
| Maximum
Aspect Ratio |
8:1 |
10:1 |
| Minimum
Board Thickness - 4 Layer |
16 mils |
12 mils |
| Minimum
Board Thickness - 6 Layer |
24 mils |
22 mils |
| Maximum
Board Thickness |
125 mils |
125 mils |
| Minimum/Maximum
Layer |
2/16 |
up to 20 |
| Minimum
SMT Device Pitch |
12 mils |
10 mils |
| Minimum
SMT Device Land Width |
8 mils |
6 mils |
| Board
Flatness Tolerance |
±0.7% |
±0.5% |
| Layer to
Layer Reg. Tolerance |
±5 mils |
±4 mils |
| Impedance
Control |
Partial |
Full |
| Entek /
Gold Plating |
Yes |
Yes |
| Board
Size |
20" *
20" |
24"
* 24" |
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| 項目/層數 |
2 Layer |
4 Layer |
6 Layer |
8 Layer |
10 Layer |
12 Layer |
| 一般件 |
5天 |
6天 |
6天 |
7天 |
7天 |
8天 |
| 急件 |
2天 |
3天 |
4天 |
4天 |
5天 |
6天 |
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